Power chips are attached to outside circuits via product packaging, and their efficiency depends upon the support of the packaging. In high-power scenarios, power chips are normally packaged as power modules. Chip affiliation refers to the electrical link on the top surface area of the chip, which is generally aluminum bonding cord in typical modules. ^
Traditional power module plan cross-section
Presently, industrial silicon carbide power components still mostly use the product packaging modern technology of this wire-bonded typical silicon IGBT module. They encounter problems such as large high-frequency parasitical specifications, inadequate heat dissipation capacity, low-temperature resistance, and insufficient insulation stamina, which restrict making use of silicon carbide semiconductors. The display screen of exceptional efficiency. In order to address these issues and fully manipulate the huge potential advantages of silicon carbide chips, many new packaging innovations and options for silicon carbide power modules have emerged in recent times.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold wire bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold wires to copper cords, and the driving force is cost reduction; high-power tools have established from aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The better the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a solid copper bridge soldered to solder to link chips and pins. Compared with standard bonding packaging methods, Cu Clip innovation has the adhering to benefits:
1. The link between the chip and the pins is made of copper sheets, which, to a specific level, changes the conventional cable bonding method in between the chip and the pins. Therefore, a special package resistance worth, higher current circulation, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not require to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.
3. The item appearance is totally consistent with typical products and is primarily used in servers, portable computers, batteries/drives, graphics cards, motors, power products, and other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding approach
Both the Gate pad and the Resource pad are clip-based. This bonding technique is more expensive and complicated, yet it can achieve far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The resource pad makes use of a Clip approach, and eviction utilizes a Cable method. This bonding method is somewhat less expensive than the all-copper bonding method, conserving wafer area (relevant to really small entrance areas). The process is less complex than the all-copper bonding technique and can get much better Rdson and much better thermal impact.
Provider of Copper Strip
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